MGSF1N02L, MVGSF1N02L
PACKAGE DIMENSIONS
PROTRUSIONS, OR GATE BURRS.
E
A
A1
1
3
D
e
2
b
H E
SEE VIEW C
SOT ? 23 (TO ? 236)
CASE 318 ? 08
ISSUE AP
c
0.25
q
L
L1
VIEW C
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M,
1982.
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM
THICKNESS OF BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH,
MILLIMETERS INCHES
DIM   MIN     NOM    MAX     MIN     NOM    MAX
A 0.89 1.00 1.11 0.035 0.040 0.044
A1 0.01     0.06     0.10     0.001    0.002    0.004
b 0.37 0.44 0.50 0.015 0.018 0.020
c 0.09 0.13 0.18 0.003 0.005 0.007
D 2.80 2.90 3.04 0.110 0.114 0.120
E 1.20 1.30 1.40 0.047 0.051 0.055
e 1.78 1.90 2.04 0.070 0.075 0.081
L 0.10 0.20 0.30 0.004 0.008 0.012
L1 0.35 0.54 0.69 0.014 0.021 0.029
H E 2.10     2.40     2.64     0.083    0.094    0.104
q 0 ° ??? 10 ° 0 ° ??? 10 °
STYLE 21:
PIN 1. GATE
2. SOURCE
3. DRAIN
SOLDERING FOOTPRINT*
0.95
0.95
0.037
0.037
2.0
0.079
0.9
0.035
0.8
SCALE 10:1
mm
inches
0.031
*For additional information on our Pb ? Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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MGSF1N02LT1/D
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